Through-hole

Improved prototyping success.

Ryder’s DIP processes are trusted by our customers to help them design, deliver and scale their products.

Overview

Our processes are backed by rigorous testing, ensuring dependable performance and long-term durability for our customers’ products.

We use DIP processes to enhance production precision and streamline operations in prototyping and low-to-medium volume manufacturing. This improves design flexibility and supports future product scaling.

Capabilities

Auto-inserting through-hole components.

Our automated processes are backed by rigorous testing, ensuring dependable performance and long-term durability for our customers’ products.

Selective wave soldering.

Enables more sophisticated PCB designs, enhances soldering precision and efficiency.

Improved ”First Time Pass” rate.

Ryder’s through-hole processes are trusted by our customers to help them to design, deliver and scale their output.

Three-proof Coating Line Assembly.

For superior protection and durability.

Real-time monitoring by MES.

Real-time process control, precise optimisation and proactive quality control.

Get started

Make your next project a success.

We're driven by delivering innovation and excellence for our customers - in precision manufacturing, in expert engineering and through trusted relationships.
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