Fast PCBA Prototyping — 7 to 12 Day Turnaround
Many development teams struggle with the PCBA Prototyping process which can be expensive, slow or managed by a provider external to their manufacturing partner, creating potential hand-over issues. To solve this problem we have invested in leading-edge technology in the form of the Essemtec Puma II rapid PCBA prototyping system. This Swiss-engineered solution jet-dispenses solder paste directly without stencil-making, significantly shortening timescales.
The main benefits of this approach:
- Speed: With a dedicated SMT line, elimination of the stencil-making process and access to quick-turn PCB manufacturers, PCBA prototypes can be returned to the customer within 7-12 days
- Precision: ±30μm placement accuracy (appropriate for 008004 chips) and automated optical inspection ensure reliable, first-time-right manufacturing
- Streamlined process: The saved time can be re-invested in more iterations and achieve faster Time to Market
- Consistency: By maintaining shared systems, materials and supply chain partners, while eliminating communication gaps and handovers, we achieve a stronger first-pass ratio and a seamless transition from prototype to full production
- Efficiency: Early-stage DFM and component optimisation cut costs and waste, with small-batch samples enabling customer feedback before mass production
SLA 3D Printing service
Our in-house Stereolithography Apparatus (SLA) 3D printers create highquality plastic prototypes with quick turnaround times and a build envelope capacity of 600 × 600 × 400 mm and accuracy down to 0.07 mm. We also conduct trial assembly and feasibility assessments of mould designs, helping accelerate product development progress and validation.
Validation Testing
Our processes are designed to ensure quality assurance and reduce warranty claims for our customers. Across our production facilities, we conduct comprehensive functional, performance, reliability and durability tests before pre-production.
Ryder provides over 50 equipment tests in its NPI Centre and customises solutions for components and end products to ensure our customers’ products have low defect levels in real-time environments. These include:
Component-level tests, for example:
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- Key life test
- Tensile strength test
- Cable bending test
- Torque testing
- Battery charge/discharge test
- Inflating/deflating system test
End product functional and performance testing, for example:
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- Usability test
- Firmware and software verification
- Audio performance
- Sound pressure level test
- RF specifications
- Power supply specifications
- Burn-in test
- Quiescent current, circuit protection
- Heating system test
Reliability & Environmental Testing - DQA Laboratory
Ryder provides over 60 equipment tests in its DQA Laboratory and customises solutions to verify product stability and reliability over its intended lifespan. These include:
- MTBF (Mean Time Between Failures) prediction
- Design margin tests for components
- Salt spray test and waterproof ingress protection test
- Durability test (alcohol wear test, rubber abrasion test, cross-cut adhesion test)
- Structural strength test (push force, pull force, press force, surface hardness)
- Environmental and accelerated life tests (temperature from -40°C to 150°C and humidity from 10%~98%)
- Thermal shock test and mechanical shock test
- Transportation tests (e.g. drop test, packaging test, vibration test)
