System on Module
Smarter Modules, Faster Deployment.
Ryder’s SOM solutions combine computing power, connectivity and reliability to support product development across embedded applications.
Overview
Our System on Module (SOM) solutions offer compact, integrated computing platforms that bring together critical system components. Designed with standard interfaces and connectors, our SOMs simplify integration into larger systems, accelerating development timelines and reducing complexity for our customers.
We have long been been early adopters of wireless innovation – using advanced SMT production, automated testing and efficient packaging processes to deliver reliable, high-performance modules. Our SOM solutions evolve with our customers’ needsand provide a seamless path from design to deployment.
Ryder delivers end-to-end SOM development and advanced manufacturing, supported by automated testing. We build from custom SOM design to full-scale production – ensuring a seamless transition from concept to deployment. Our SOMs are deployable across IoT edge devices, smart building, industrial automation, medical diagnostics, and next-gen wireless solutions, delivering consistent and reliable performance.
Our Specialist System on Module Capabilities
Full Customisation & Modular Design.
We tailor SOMs to customers’ exact requirements – rigorously validating performance, durability and quality. This allows us to serve diverse embedded applications and peripherals into high-density modules – reducing design complexity and BOM risk. Thanks to pre-certified wireless solutions and pre-integrated OS support, we can accelerate development cycles and certification.
High-Efficiency SMT Production.
Our use of advanced SMT lines, intelligent warehouse systems with Automated Guided Vehicles (AGVs) and a Manufacturing Execution System (MES) digital platform allows us to automate order dispatching from warehouse to production and shipment. Our capabilities include handling flexible printed circuits (FPCs) and precision assembly with ultra-fine 01005 components, ensuring optimal performance and miniaturisation at all sizes.
Robotic Testing & Packing.
System-on-Modules undergo fully automated robotic testing with integrated flash code programming and testing programs. Each module is subjected to rigorous environmental validation including temperature cycling and humidity testing to guarantee stable operation in extreme conditions. For complete traceability, every unit features a laser-etched Unique ID, and QR codes containing full manufacturing history – from batch/lot details and comprehensive test logs to compliance certification records. The process concludes with automated packaging systems that perform final integrity verification before secure sealing.
Data Security & Cybersecurity.
We adhere to the ISO 27001 standard to safeguard confidential data, including test data, production specifications, design documents, customer information and personally identifiable information (PII). We help prevent cyber intrusions and data breaches through the use of multi-layered security measures, such as firewalls, anti-virus software, isolated production networks, data encryption, regular penetration testing and robust information security protocols.
Tier 1 Semiconductor Partnerships.
Our close collaboration with leading chip suppliers ensures access to the latest silicon innovations, while maintaining industry-leading low defect rates. Ryder’s SOMs are designed to simplify integration and future-proof your embedded systems.
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