Engineering Capability
- Ryder's Engineering Capabilities
- Our New Product Development Team has capabilities in almost all aspects of electronic, firmware and software design, from low cost simple products through to complex systems.
- Electronics, Firmware and Software Engineering
- We have special skills in micro-processor based embedded application development. We are particularly strong in:
- - Peripheral devices including gaming controllers
- - USB solutions
- - Bluetooth designs
- - RF designs, from low cost 27MHz / 900MHz to sophisticated 2.4GHz wireless
- - Audio amplifiers
- - Logic circuits and high frequency circuits in consumer and commercial electronics products
- Mechanical Engineering
- We offer state-of-the-art 3D CAD/CAM software and facilities from industrial design stage, through internal construction and development, to packaging design. We will generate innovative concepts and solve thorny problems to develop the product you need to the right specifications and at the right time.
- Using sophisticated Solidworks 3D modeling software, we create and modify realistic 3D renderings on the same file, which then go directly to the tool-makers. We spend the extra time necessary to get the mechanical design right first time for manufacture. This saves cost and more importantly gets the product to market faster.
- Customized Application Team
- A dedicated team named the Customized Application Team (CAT) was set up in 2008 to develop technologies in a modular approach. This is to provide our customers with ready-to-use modules that can be easily adopted in their products right away for faster time to market.
- Currently, the CAT is working on 2.4GHz digital audio/video streaming modules for simultaneous stereo channels, weather forecast modules with humidity sensors, temperature sensors and pressure sensors. The team has also developed the capacity for production of accessories compatible with iPod and iPhone.
